Semiconductors
Semiconductor AI inspection for defects that sit at the edge of visibility, low in contrast and easily mistaken for polishing traces or normal surface texture. These deployments show fabs and packaging lines catching what AOI overkills or misses, from CMP scratches to dicing chips.
CMP Quality Inspection Using AI
SolVision AI-based CMP quality inspection detects wafer scratches and contamination, overcoming limitations of rule-based AOI in semiconductor inspection.
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BGA Soldering Inspection Using AI
SolVision AI detects BGA soldering defects, improving inspection consistency, accuracy, and inline quality control in PCB and semiconductor production.
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Verifying Plastic Parts for Recycling Using AI
Explore how META-aivi optimizes waste management with AI, reducing errors and avoiding contamination while enhancing the efficiency of plastic parts recycling.
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Intelligent Remote Facility Management
Machine vision is utilized to perform Optical Character Recognition (OCR). This information is sent to the cloud to create an inspection report, allowing plant operators to easily monitor facility inspection through mobile devices.
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IC Tray Inspection Using AI
SolVision employs AI to enhance IC tray inspection, ensuring precise detection and elevating quality assurance standards in the semiconductor industry.
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AI Inspection Solution for Semiconductor Wafers
Using SolVision’s AI Inspection Solution, minute defects such as fine scratches can be located and marked on sample images to train the AI model.
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Visual Inspection of Semiconductor Trays
Solomon SolVision’s Feature Detection tool first learns the position of the tray, then performs OCR with more flexibility than AOI systems.
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Visual Inspection of Semiconductor Carrier Trays
Automated defect detection with artificial intelligence. Visual Inspection of Semiconductor Carrier Trays.
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AI Inspection for Semiconductor Components
Overcoming traditional AOI limitations, Solomon’s SolVision quickly performs OCR without being affected by background or lighting conditions, complexity, or appearance of the serial number.
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Automating Quality Inspection of Lead Frames
As semiconductor manufacturing becomes more sophisticated, the process of creating lead frames needs to improve in accuracy and yield.
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Detecting Adhesion Defects in Semiconductors
Excessive adhesive may remain on the chip or overflow on the circuit board and cause the chip to tilt, affecting stability of the whole semiconductor package.
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Automating Semiconductor Wafer Inspections
Faulty wafers also usually have subtle defects randomly scattered on the surface, and this prevents AOI systems from setting rules for efficient inspections.
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Inspecting Semiconductor Packaging Processes
SolVision enables visual inspection through AI image analysis, strengthening the reliability of displacement and angle information to recognize defective products and errors in the die bonding process.
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Quality Control of Wafer Dicing
Using SolVision’s Instance Segmentation tool, irregular lines and multi-drilling defects are labeled in sample images to train the AI model.
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Detecting Chipping Defects in Wafer Dicing
The location, size and shape of cracks vary each time, and traditional optical inspection cannot accurately identify such unpredictable defects.
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