{"id":86654,"date":"2025-02-12T11:45:36","date_gmt":"2025-02-12T03:45:36","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=86654"},"modified":"2025-02-19T08:57:29","modified_gmt":"2025-02-19T00:57:29","slug":"automatizando-a-inspecao-de-qualidade-de-quadros-de-chumbo","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/pt\/casos-de-sucesso\/automatizando-a-inspecao-de-qualidade-de-quadros-de-chumbo\/","title":{"rendered":"Automatizando a Inspe\u00e7\u00e3o de Qualidade de Quadros de Chumbo"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"795\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56257\" alt=\"black and white labeled box\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k.jpg 795w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k-199x300.jpg 199w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k-768x1159.jpg 768w\" sizes=\"(max-width: 795px) 100vw, 795px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-d51e703b-ff95\" class=\"gspb_heading gspb_heading-id-gsbp-d51e703b-ff95\">SolVision<span class=\"gspb_heading_subtitle\">Caso de Estudo<\/span><\/h2>\n\n\n\n<div id=\"gspb_text-id-gsbp-7b121aa9-5d52\" class=\"gspb_text gspb_text-id-gsbp-7b121aa9-5d52\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/pt\/category\/case-studies\/Semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semicondutores<\/a><\/span><\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Automatizando a Inspe\u00e7\u00e3o de Qualidade de Quadros de Chumbo<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"deteccao-de-defeitos-em-quadros-de-chumbo-para-semicondutores-com-ia\"><strong><strong>Detec\u00e7\u00e3o de defeitos em quadros de chumbo para semicondutores com IA\u00a0<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"um-componente-essencial-na-montagem-de-semicondutores\"><strong><strong><strong>Um componente essencial na montagem de semicondutores<\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">No processo de montagem de semicondutores, os lead frames conectam os chips \u00e0s placas de circuito impresso e tamb\u00e9m s\u00e3o utilizados para suporte de chips, conex\u00e3o de circuitos e transmiss\u00e3o de sinais. Quase todos os pacotes de semicondutores exigem um lead frame, que pode ser produzido por fotograva\u00e7\u00e3o qu\u00edmica ou estampagem mec\u00e2nica. \u00c0 medida que a fabrica\u00e7\u00e3o de semicondutores se torna mais avan\u00e7ada, a produ\u00e7\u00e3o de lead frames precisa melhorar em precis\u00e3o e rendimento.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/S001-600x607.jpg\" alt=\"AI defect detection for semiconductor lead frames\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"fundos-complexos-podem-afetar-as-taxas-de-deteccao\"><strong><strong>Fundos complexos podem afetar as taxas de detec\u00e7\u00e3o<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Um \u00fanico defeito no lead frame pode resultar na falha completa do semicondutor. Identificar defeitos precocemente no processo de produ\u00e7\u00e3o \u00e9, portanto, crucial para ajudar os fabricantes a evitar desperd\u00edcios de tempo e recursos. Os defeitos mais comuns nos lead frames incluem rebarbas nas bordas, impurezas, manchas e arranh\u00f5es. Ao escanear superf\u00edcies, os sistemas de vis\u00e3o tradicionais tendem a se confundir quando os defeitos s\u00e3o muito semelhantes ou se misturam ao fundo, afetando a precis\u00e3o da inspe\u00e7\u00e3o.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"reconhecimento-de-defeitos-com-inteligencia-artificial\"><strong><strong>Reconhecimento de defeitos com intelig\u00eancia artificial<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Impulsionado por IA, o <a href=\"https:\/\/solomon-3d.mesvr.tw\/pt\/products\/solvision\/\">SolVision<\/a> \u00e9 um sistema de inspe\u00e7\u00e3o visual capaz de aprender diferentes defeitos de produ\u00e7\u00e3o enquanto minimiza erros de detec\u00e7\u00e3o. A ferramenta de aumento de dados do software amplia o escopo de treinamento do modelo de IA, permitindo que at\u00e9 mesmo defeitos em fundos complexos ou desordenados sejam reconhecidos. Falhas sutis, bordas ou manchas escuras e protuber\u00e2ncias nas bordas tamb\u00e9m podem ser identificadas com precis\u00e3o.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspecao-por-ia\"><strong><strong><strong><strong>Inspe\u00e7\u00e3o por IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Amostra Padr\u00e3o<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/S003-600x616.png\" alt=\"Automating Quality Inspection of Lead Frames\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Manchas pretas e bordas elevadas<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/S004-600x601.jpg\" alt=\"Automating Quality Inspection of Lead Frames\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>\u00c0 medida que a fabrica\u00e7\u00e3o de semicondutores se torna mais sofisticada, o processo de cria\u00e7\u00e3o de moldes de chip (lead frames) precisa melhorar em precis\u00e3o e rendimento.<\/p>","protected":false},"author":875,"featured_media":56257,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-d51e703b-ff95{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:50px}#gspb_heading-id-gsbp-d51e703b-ff95 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-d51e703b-ff95 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-d51e703b-ff95{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gspb_text-id-gsbp-7b121aa9-5d52{font-size:20px;text-align:center!important;font-weight:500!important;margin-top:0!important}.gspb_text-id-gsbp-7b121aa9-5d52 .gsap-g-line{text-align:center!important}.gspb_text-id-gsbp-7b121aa9-5d52,.gspb_text-id-gsbp-7b121aa9-5d52 .wp-block a,.gspb_text-id-gsbp-7b121aa9-5d52 a{color:var(--wp--preset--color--white, 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