{"id":86268,"date":"2025-02-10T17:10:58","date_gmt":"2025-02-10T09:10:58","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=86268"},"modified":"2025-02-19T08:58:02","modified_gmt":"2025-02-19T00:58:02","slug":"deteccao-de-defeitos-de-desprendimento-no-corte-de-wafers","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/pt\/casos-de-sucesso\/deteccao-de-defeitos-de-desprendimento-no-corte-de-wafers\/","title":{"rendered":"Detec\u00e7\u00e3o de Defeitos de Desprendimento no Corte de Wafers"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Caso de Estudo<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/pt\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semicondutores<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Detec\u00e7\u00e3o de Defeitos de Desprendimento no Corte de Wafers<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"controle-de-qualidade-de-chips-de-semicondutores-com-ia\"><strong><strong>Controle de qualidade de chips de semicondutores com IA<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"reducao-do-tamanho-de-wafers-de-semicondutores\"><strong>Redu\u00e7\u00e3o do tamanho de wafers de semicondutores<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">O corte de <a href=\"https:\/\/pt.wikipedia.org\/wiki\/Wafer_(eletr%C3%B4nica)\" target=\"_blank\" rel=\"noopener\">wafers<\/a> ajuda a singulizar o wafer em chips individuais para o processamento subsequente. \u00c0 medida que a eletr\u00f4nica moderna exige wafers mais finos, menores e leves, o processo de redu\u00e7\u00e3o dos chips de wafer exige cortes mais meticulosos. Os caminhos de corte s\u00e3o estreitados, os cristais de sil\u00edcio se tornam mais fr\u00e1geis e os danos causados pelo corte se tornam mais frequentes.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E5%9C%96%E7%89%871-4-800x448.png\" alt=\"Quality control of semiconductor die with AI\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"imprevisibilidade-das-rachaduras-nas-bordas-do-chip\"><strong>Imprevisibilidade das rachaduras nas bordas do chip<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">As bordas rachadas causadas durante o corte do wafer danificam a resist\u00eancia do wafer. Em casos graves, isso pode levar \u00e0 quebra quando o chip \u00e9 submetido a estresse nos processos de produ\u00e7\u00e3o subsequentes. A localiza\u00e7\u00e3o, o tamanho e a forma das rachaduras variam a cada vez, e a <a href=\"https:\/\/en.wikipedia.org\/wiki\/Automated_optical_inspection\" target=\"_blank\" rel=\"noopener\">inspe\u00e7\u00e3o \u00f3ptica tradicional<\/a> n\u00e3o consegue identificar com precis\u00e3o esses defeitos imprevis\u00edveis.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"estabelecendo-as-bases-para-embalagens-com-ia\"><strong>Estabelecendo as bases para embalagens com IA<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Oferecendo um reconhecimento superior, o <a href=\"https:\/\/solomon-3d.mesvr.tw\/pt\/products\/solvision\/\">SolVision<\/a> pode treinar um modelo de IA capaz de inspecionar wafers e reconhecer defeitos de produ\u00e7\u00e3o por meio do processamento de imagens. O sistema permite que diferentes varia\u00e7\u00f5es de bordas rachadas sejam detectadas e localizadas automaticamente em tempo real, reduzindo consideravelmente a possibilidade de quebra nos processos de embalagem subsequentes.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspecao-por-ia\"><strong><strong><strong><strong>Inspe\u00e7\u00e3o por IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Bordas rachadas<\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%82_0806-600x317.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%822_0806.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>A localiza\u00e7\u00e3o, o tamanho e a forma das rachaduras variam a cada vez, e a inspe\u00e7\u00e3o \u00f3ptica tradicional n\u00e3o consegue identificar com precis\u00e3o esses defeitos imprevis\u00edveis.<\/p>","protected":false},"author":875,"featured_media":56103,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3213,3229,3239,3247,3223],"tags":[],"class_list":["post-86268","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-casos-de-sucesso","category-deteccao-de-defeitos","category-inspecao-de-qualidade","category-semiconductors","category-solvision"],"acf":[],"lang":"pt","translations":{"pt":86268,"en":32274,"tw":32464,"zh":57064,"jp":78891,"es":82545,"de":87643,"fr":89163,"vi":93278,"tr":91039,"th":96440,"it":98242,"ko":94733},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/posts\/86268","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/comments?post=86268"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/posts\/86268\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/media\/56103"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/media?parent=86268"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/categories?post=86268"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/pt\/wp-json\/wp\/v2\/tags?post=86268"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}