{"id":98242,"date":"2025-04-22T09:39:21","date_gmt":"2025-04-22T01:39:21","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=98242"},"modified":"2025-04-22T09:40:02","modified_gmt":"2025-04-22T01:40:02","slug":"rilevamento-di-difetti-di-scheggiatura-nel-dicing-dei-wafer","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/it\/casi-di-successo\/rilevamento-di-difetti-di-scheggiatura-nel-dicing-dei-wafer\/","title":{"rendered":"Rilevamento di Difetti di Scheggiatura nel Dicing dei Wafer"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Caso di Studio<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/it\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semiconduttori<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Rilevamento di Difetti di Scheggiatura nel Dicing dei Wafer<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"controllo-qualita-dei-die-semiconduttori-con-l-ai\"><strong><strong>Controllo qualit\u00e0 dei die semiconduttori con l&#8217;AI<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"riduzione-delle-dimensioni-dei-wafer-semiconduttori\"><strong>Riduzione delle dimensioni dei wafer semiconduttori<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Il taglio dei <a href=\"https:\/\/en.wikipedia.org\/wiki\/Wafer_(electronics)\" target=\"_blank\" rel=\"noopener\">wafer<\/a> consente di suddividere il wafer in singoli die per le successive fasi di lavorazione. Poich\u00e9 l\u2019elettronica moderna richiede wafer pi\u00f9 sottili, piccoli e leggeri, i chip pi\u00f9 piccoli richiedono processi di taglio pi\u00f9 precisi. I percorsi di taglio sono pi\u00f9 stretti, i cristalli di silicio diventano pi\u00f9 fragili e i danni causati dal taglio sono pi\u00f9 frequenti.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E5%9C%96%E7%89%871-4-800x448.png\" alt=\"Quality control of semiconductor die with AI\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"imprevedibilita-delle-crepe-ai-bordi-dei-die\"><strong>Imprevedibilit\u00e0 delle crepe ai bordi dei die<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Le crepe ai bordi causate durante il dicing dei wafer compromettono la resistenza del wafer. Nei casi pi\u00f9 gravi, possono provocarne la rottura quando il chip \u00e8 sottoposto a stress nelle fasi successive della produzione. La posizione, la dimensione e la forma delle crepe variano ogni volta, e <a href=\"https:\/\/en.wikipedia.org\/wiki\/Automated_optical_inspection\" target=\"_blank\" rel=\"noopener\">l\u2019ispezione ottica tradizionale<\/a> non \u00e8 in grado di identificare con precisione questi difetti imprevedibili.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"creare-basi-solide-per-il-packaging-con-l-ai\"><strong>Creare basi solide per il packaging con l\u2019AI<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Grazie alle sue avanzate capacit\u00e0 di riconoscimento, <a href=\"https:\/\/solomon-3d.mesvr.tw\/it\/products\/solvision\/\">SolVision<\/a> pu\u00f2 addestrare un modello AI in grado di ispezionare i wafer e riconoscere i difetti di produzione tramite l\u2019elaborazione delle immagini. Il sistema consente di rilevare automaticamente in tempo reale le diverse varianti di scheggiature ai bordi, riducendo notevolmente il rischio di rottura durante le fasi successive del packaging.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"ispezione-ai\"><strong><strong><strong><strong>Ispezione AI<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Crepe ai bordi<\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%82_0806-600x317.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%822_0806.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>La posizione, la dimensione e la forma delle crepe variano ogni volta, e l\u2019ispezione ottica tradizionale non \u00e8 in grado di identificare con precisione questi difetti imprevedibili.<\/p>","protected":false},"author":875,"featured_media":56103,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox{color:var(--wp--preset--color--black, #000000)}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox svg,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox svg{fill:var(--wp--preset--color--black, #000000)}.gs-titlebox .gs-title-inbox{display:flex;align-content:center;padding:15px 20px;font-weight:700;font-size:115%}.gs-titlebox .gs-title-inbox-label{flex-grow:1}.gs-titlebox .gs-titlebox-text{padding:20px}","footnotes":""},"categories":[4492,4558,4502,4564,4574],"tags":[],"class_list":["post-98242","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-casi-di-successo","category-controllo-qualita","category-rilevamento-difetti","category-semiconductors","category-solvision"],"acf":[],"lang":"it","translations":{"it":98242,"en":32274,"tw":32464,"zh":57064,"jp":78891,"es":82545,"pt":86268,"de":87643,"fr":89163,"vi":93278,"tr":91039,"th":96440,"ko":94733},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/posts\/98242","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/comments?post=98242"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/posts\/98242\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/media\/56103"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/media?parent=98242"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/categories?post=98242"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/it\/wp-json\/wp\/v2\/tags?post=98242"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}