{"id":89607,"date":"2025-02-26T14:03:00","date_gmt":"2025-02-26T06:03:00","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89607"},"modified":"2025-02-26T14:03:35","modified_gmt":"2025-02-26T06:03:35","slug":"solution-dinspection-par-ia-pour-les-wafers-semi-conducteurs","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/solution-dinspection-par-ia-pour-les-wafers-semi-conducteurs\/","title":{"rendered":"Solution d&#8217;inspection par IA pour les wafers semi-conducteurs"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"795\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56257\" alt=\"black and white labeled box\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k.jpg 795w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k-199x300.jpg 199w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/rozwxefl27k-768x1159.jpg 768w\" sizes=\"(max-width: 795px) 100vw, 795px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">\u00c9tude de cas<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns has-white-color has-text-color eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semi-conducteurs<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Solution d&#8217;inspection par IA pour les wafers semi-conducteurs<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"controle-qualite-des-processus-de-polissage-mecano-chimique-cmp\"><strong><strong>Contr\u00f4le qualit\u00e9 des processus de polissage m\u00e9cano-chimique (CMP)<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"cmp-et-surfaces-des-wafers\"><strong>CMP et surfaces des wafers<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Le polissage m\u00e9cano-chimique (<a href=\"https:\/\/fr.wikipedia.org\/wiki\/Polissage_m%C3%A9canochimique\" target=\"_blank\" rel=\"noopener\">Chemical Mechanical Planarization &#8211; CMP<\/a>) est un processus essentiel dans la fabrication des semi-conducteurs, destin\u00e9 \u00e0 corriger les petits d\u00e9fauts cr\u00e9\u00e9s lors des \u00e9tapes de production pr\u00e9c\u00e9dentes. Chaque couche de wafer doit \u00eatre polie pour \u00e9liminer les mat\u00e9riaux exc\u00e9dentaires avant la fabrication de la couche suivante. Cependant, la pr\u00e9sence de particules trop grosses et d\u2019abrasions issues du fluide de polissage peut entra\u00eener l\u2019apparition de micro-rayures sur la surface du wafer, qui figurent parmi les d\u00e9fauts les plus courants du processus CMP.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/J001-1-800x396.png\" alt=\"Quality control of chemical mechanical polishing (CMP) processes\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"arriere-plans-complexes-et-defauts-subtils-des-wafers\"><strong>Arri\u00e8re-plans complexes et d\u00e9fauts subtils des wafers<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Les d\u00e9fauts li\u00e9s au CMP incluent g\u00e9n\u00e9ralement des micro-rayures, des r\u00e9sidus de particules et des d\u00e9bris issus du tampon de polissage. Apr\u00e8s le polissage, le wafer pr\u00e9sente des traces extr\u00eamement fines qui forment un arri\u00e8re-plan complexe dans les images d&#8217;inspection. Comme ces d\u00e9fauts varient en type, position et apparence, leur d\u00e9tection est difficile. D&#8217;autres d\u00e9fauts de surface, tels que les taches blanches, les taches noires, les traces d\u2019eau et les bulles, sont diversifi\u00e9s et n&#8217;ont pas de caract\u00e9ristiques distinctes standardis\u00e9es. Les syst\u00e8mes <a href=\"https:\/\/en.wikipedia.org\/wiki\/Automated_optical_inspection\" target=\"_blank\" rel=\"noopener\">traditionnels<\/a> bas\u00e9s sur des r\u00e8gles logiques et des algorithmes sont insuffisants pour inspecter efficacement l\u2019ensemble du wafer.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"detection-des-defauts-par-l-ia\"><strong>D\u00e9tection des d\u00e9fauts par l&#8217;IA<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Gr\u00e2ce \u00e0 l\u2019outil de segmentation de <a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/products\/solvision\/\">SolVision<\/a>, les d\u00e9fauts les plus infimes, tels que les micro-rayures, sont identifi\u00e9s et marqu\u00e9s sur des images d\u2019\u00e9chantillons pour entra\u00eener le mod\u00e8le d\u2019IA. M\u00eame en pr\u00e9sence d\u2019arri\u00e8re-plans complexes, SolVision met en \u00e9vidence ces d\u00e9fauts subtils et permet d\u2019identifier rapidement leur emplacement et leur taille, am\u00e9liorant ainsi la pr\u00e9cision des inspections.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspection-par-ia\"><strong><strong><strong><strong>Inspection par IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Surface Ray\u00e9e<\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/W001-600x603.jpg\" alt=\"Wafer grinding defect detection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/W002-600x603.jpg\" alt=\"Wafer grinding defect detection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>En utilisant la solution d&#8217;inspection par IA de SolVision, des d\u00e9fauts minimes tels que de fines rayures peuvent \u00eatre localis\u00e9s et marqu\u00e9s sur des images d&#8217;\u00e9chantillons pour entra\u00eener le mod\u00e8le d&#8217;IA.<\/p>","protected":false},"author":875,"featured_media":103877,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3620,3612,3600,3670,3688],"tags":[],"class_list":["post-89607","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-etudes-de-cas","category-controle-qualite","category-detection-de-defauts","category-semiconductors","category-solvision"],"acf":[],"lang":"fr","translations":{"fr":89607,"en":32262,"es":81727,"tw":32449,"zh":56879,"jp":78541,"pt":86937,"de":88948,"tr":91059,"vi":92054,"th":96762,"it":98156,"ko":95145},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89607","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/comments?post=89607"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89607\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media\/103877"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media?parent=89607"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/categories?post=89607"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/tags?post=89607"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}