{"id":89602,"date":"2025-02-26T13:43:56","date_gmt":"2025-02-26T05:43:56","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89602"},"modified":"2025-02-26T13:44:10","modified_gmt":"2025-02-26T05:44:10","slug":"controle-de-qualite-du-decoupage-des-wafers","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/controle-de-qualite-du-decoupage-des-wafers\/","title":{"rendered":"Contr\u00f4le de qualit\u00e9 du d\u00e9coupage des wafers"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1600\" height=\"1047\" class=\"wp-block-cover__image-background wp-image-56108\" alt=\"pink green and blue square pattern\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm.jpg 1600w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm-300x196.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm-768x503.jpg 768w\" sizes=\"(max-width: 1600px) 100vw, 1600px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">\u00c9tude de cas<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semi-conducteurs<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Contr\u00f4le de qualit\u00e9 du d\u00e9coupage des wafers<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"ai-inspection-of-dicing-blade-defects\">Inspection par IA des d\u00e9fauts des lames de d\u00e9coupe<\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"qualite-des-lames-et-outils-de-decoupe-des-wafers\"><strong>Qualit\u00e9 des lames et outils de d\u00e9coupe des wafers<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Le d\u00e9veloppement rapide des produits \u00e9lectroniques modernes a intensifi\u00e9 la demande et les exigences de qualit\u00e9 pour les puces semi-conductrices. Les avanc\u00e9es technologiques dans la fabrication ont \u00e9galement conduit \u00e0 des wafers en silicium plus l\u00e9gers, plus fins et plus petits. Pour assurer un rendement \u00e9lev\u00e9 et optimiser le d\u00e9bit de production, le d\u00e9coupage et la s\u00e9paration des wafers sont des aspects cruciaux \u00e0 surveiller, la cl\u00e9 de la qualit\u00e9 du d\u00e9coupage r\u00e9sidant dans la lame utilis\u00e9e et son contr\u00f4le.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E5%8F%B0%E7%A9%8D%E9%9B%BB_02%E6%AA%A2%E6%B8%AC-600x304.png\" alt=\"AI inspection of dicing blade defects\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"motifs-circulaires-et-arriere-plans-complexes\"><strong>Motifs circulaires et arri\u00e8re-plans complexes<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Le d\u00e9coupage des wafers est un processus courant dans les industries des semi-conducteurs et de l\u2019opto\u00e9lectronique. Lorsque ce processus ne peut pas maintenir un rendement et une efficacit\u00e9 optimaux sans compromettre les caract\u00e9ristiques des puces, la capacit\u00e9 de production est fortement impact\u00e9e. Le contr\u00f4le qualit\u00e9 des lames de d\u00e9coupe repose principalement sur l\u2019inspection des d\u00e9fauts d\u2019apparence. Les lames endommag\u00e9es pr\u00e9sentent souvent des lignes irr\u00e9guli\u00e8res ou des d\u00e9fauts de per\u00e7age multiples sur leur surface. Les motifs denses et en anneaux des lames de d\u00e9coupe cr\u00e9ent \u00e9galement des arri\u00e8re-plans complexes qui r\u00e9duisent les taux de d\u00e9tection des syst\u00e8mes d\u2019inspection traditionnels.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"inspections-visuelles-basees-sur-l-ia\"><strong>Inspections visuelles bas\u00e9es sur l&#8217;IA<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Gr\u00e2ce \u00e0 l\u2019outil de segmentation de <a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/products\/solvision\/\">SolVision<\/a>, les lignes irr\u00e9guli\u00e8res et les d\u00e9fauts de per\u00e7age multiples sont \u00e9tiquet\u00e9s dans des images d\u2019\u00e9chantillons pour entra\u00eener le mod\u00e8le d\u2019IA. En exploitant des algorithmes puissants et une technologie avanc\u00e9e de vision industrielle, SolVision peut identifier divers d\u00e9fauts sur les lames de d\u00e9coupe des wafers en temps r\u00e9el afin de garantir leur qualit\u00e9, sans \u00eatre affect\u00e9 par la complexit\u00e9 des arri\u00e8re-plans ou des d\u00e9fauts.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspection-par-ia\"><strong><strong><strong><strong>Inspection par IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Image scann\u00e9e<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2021-07-16_11h15_31.png\" alt=\"Wafer dicing knife defect detection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>R\u00e9sultat de d\u00e9tection<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-full eplus-wrapper\"><img decoding=\"async\" width=\"754\" height=\"754\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121.jpg\" alt=\"Wafer dicing knife defect detection case\" class=\"wp-image-55690\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121.jpg 754w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121-300x300.jpg 300w\" sizes=\"(max-width: 754px) 100vw, 754px\" \/><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>En utilisant l&#8217;outil de segmentation d&#8217;instances de SolVision, les lignes irr\u00e9guli\u00e8res et les d\u00e9fauts de per\u00e7age multiple sont \u00e9tiquet\u00e9s dans des images d&#8217;\u00e9chantillon pour entra\u00eener le mod\u00e8le d&#8217;IA.<\/p>","protected":false},"author":875,"featured_media":55690,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3620,3612,3600,3670,3688],"tags":[],"class_list":["post-89602","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-etudes-de-cas","category-controle-qualite","category-detection-de-defauts","category-semiconductors","category-solvision"],"acf":[],"lang":"fr","translations":{"fr":89602,"en":32273,"tw":32463,"zh":57078,"jp":78877,"es":83186,"pt":86925,"de":88944,"tr":91055,"vi":91931,"th":96759,"it":98153,"ko":95830},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89602","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/comments?post=89602"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89602\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media\/55690"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media?parent=89602"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/categories?post=89602"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/tags?post=89602"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}