{"id":89321,"date":"2025-02-25T14:45:28","date_gmt":"2025-02-25T06:45:28","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89321"},"modified":"2025-02-25T14:47:19","modified_gmt":"2025-02-25T06:47:19","slug":"inspection-visuelle-des-plateaux-de-transport-de-semi-conducteurs","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/inspection-visuelle-des-plateaux-de-transport-de-semi-conducteurs\/","title":{"rendered":"Inspection visuelle des plateaux de transport de semi-conducteurs"},"content":{"rendered":"
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<\/span>\"pink
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SolVision\u00c9tude de cas<\/span><\/h2>\n\n\n\n
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Semi-conducteurs<\/a><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n

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Inspection visuelle des plateaux de transport de semi-conducteurs<\/h1><\/div><\/div>\n\n\n\n

D\u00e9tection automatis\u00e9e des d\u00e9fauts avec intelligence artificielle<\/strong><\/strong><\/h2>\n\n\n\n
<\/div>\n\n\n\n
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Stabilit\u00e9 et positionnement des plateaux de semi-conducteurs<\/strong><\/h2>\n\n\n\n

Les plateaux de transport de semi-conducteurs sont indispensables au traitement des semi-conducteurs et se pr\u00e9sentent sous diff\u00e9rents formats et mat\u00e9riaux en fonction de l’application et de l’environnement. En plus de garantir la s\u00e9curit\u00e9 et la stabilit\u00e9 des puces, la position et les points de pr\u00e9l\u00e8vement des plateaux doivent correspondre pr\u00e9cis\u00e9ment aux m\u00e9canismes d’alimentation pendant la production. La qualit\u00e9 du plateau refl\u00e8te donc le succ\u00e8s de l’automatisation de la production.<\/p>\n<\/div>\n\n\n\n

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\"Automated<\/figure>\n<\/div>\n<\/div>\n\n\n\n
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Inspection des arri\u00e8re-plans complexes et des d\u00e9fauts obscurs<\/strong><\/h2>\n\n\n\n

Les contours et les trous de positionnement des plateaux de transport sont sujets \u00e0 des d\u00e9fauts tels que des \u00e9clats et des d\u00e9formations caus\u00e9s par la temp\u00e9rature de production et un usage prolong\u00e9. Ces plateaux \u00e9taient auparavant inspect\u00e9s \u00e0 l’aide de m\u00e9thodes traditionnelles. Cependant, en raison de leurs formats complexes et de la nature obscure et al\u00e9atoire des d\u00e9fauts des plateaux, l’utilisation de syst\u00e8mes de vision bas\u00e9s sur des r\u00e8gles pour les t\u00e2ches d’inspection visuelle a souvent conduit \u00e0 des probl\u00e8mes de rendement et d’efficacit\u00e9 de production.<\/p>\n<\/div><\/div><\/div>\n\n\n\n

<\/div>
<\/div><\/div>
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Surmonter les obstacles des inspections traditionnelles<\/strong><\/h2>\n\n\n\n

L’outil de segmentation de SolVision<\/a> est capable de reconna\u00eetre les d\u00e9fauts en les localisant et en les \u00e9tiquetant, m\u00eame dans des arri\u00e8re-plans complexes, afin de surveiller les anomalies de production et de pouvoir \u00e9liminer les plateaux d\u00e9fectueux en temps r\u00e9el.<\/p>\n<\/div><\/div><\/div>\n\n\n\n

<\/p>\n\n\n\n

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Inspection par IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n

Inspection compl\u00e8te<\/strong><\/p>\n\n\n\n

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Original<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n\n\n\n
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R\u00e9sultat<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n<\/div>\n\n\n\n

Espaces des trous de positionnement et d\u00e9fauts de cadre<\/strong><\/p>\n\n\n\n

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Original<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n\n\n\n
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R\u00e9sultat<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n<\/div>\n\n\n\n

Inspection compl\u00e8te<\/strong><\/p>\n\n\n\n

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Original<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n\n\n\n
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R\u00e9sultat<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n<\/div>\n\n\n\n

D\u00e9fauts de bord<\/strong><\/p>\n\n\n\n

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Original<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n\n\n\n
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R\u00e9sultat<\/strong><\/p>\n\n\n\n

\"IC<\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"

D\u00e9tection automatis\u00e9e des d\u00e9fauts avec intelligence artificielle. Inspection visuelle des plateaux de transport de semiconducteurs.<\/p>","protected":false},"author":875,"featured_media":20680,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-d51e703b-ff95{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-d51e703b-ff95 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-d51e703b-ff95 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-d51e703b-ff95{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox{color:var(--wp--preset--color--black, #000000)}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox svg,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox svg{fill:var(--wp--preset--color--black, #000000)}.gs-titlebox .gs-title-inbox{display:flex;align-content:center;padding:15px 20px;font-weight:700;font-size:115%}.gs-titlebox .gs-title-inbox-label{flex-grow:1}.gs-titlebox .gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3620,3600,3670,3688],"tags":[],"class_list":["post-89321","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-etudes-de-cas","category-detection-de-defauts","category-semiconductors","category-solvision"],"acf":[],"lang":"fr","translations":{"fr":89321,"es":81556,"vi":93661,"tw":32424,"zh":57007,"jp":77530,"pt":86447,"de":88225,"tr":91565,"en":32236,"th":100912,"it":100917,"ko":100920},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89321","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/comments?post=89321"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89321\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media\/20680"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media?parent=89321"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/categories?post=89321"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/tags?post=89321"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}