{"id":89177,"date":"2025-02-25T08:42:34","date_gmt":"2025-02-25T00:42:34","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89177"},"modified":"2025-02-25T08:43:29","modified_gmt":"2025-02-25T00:43:29","slug":"inspection-des-plateaux-de-circuits-integres-ic-a-laide-de-lia","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/inspection-des-plateaux-de-circuits-integres-ic-a-laide-de-lia\/","title":{"rendered":"Inspection des plateaux de circuits int\u00e9gr\u00e9s (IC) \u00e0 l’aide de l’IA"},"content":{"rendered":"
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<\/span>\"a
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SolVision\u00c9tude de cas<\/strong><\/span><\/h2>\n\n\n\n
Semi-conducteurs<\/a><\/div>\n<\/div><\/div>\n\n\n\n
<\/div>\n\n\n

Inspection des plateaux de circuits int\u00e9gr\u00e9s (IC) \u00e0 l’aide de l’IA<\/h1><\/div><\/div>\n\n\n\n
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Cas<\/h2>\n\n\n\n
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Assurer la qualit\u00e9 dans la manipulation des plateaux IC<\/h3>\n\n\n\n

Apr\u00e8s que les puces aient subi des processus d’inspection et de s\u00e9paration, elles sont transf\u00e9r\u00e9es dans des compartiments d\u00e9sign\u00e9s au sein des plateaux de circuits int\u00e9gr\u00e9s. Ces plateaux maintiennent en toute s\u00e9curit\u00e9 les puces jusqu’\u00e0 ce qu’elles soient pr\u00eates pour l’exp\u00e9dition finale aux clients. Cependant, la petite taille et le faible poids des puces les rendent susceptibles de duplication, de mauvaise placement, d’inclinaison ou d’inversion lors de la manipulation dans les plateaux.<\/p>\n<\/div>\n<\/div>\n\n\n\n

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<\/div>\n\n\n\n
\"Interface<\/div>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
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D\u00e9fi<\/h2>\n\n\n\n
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Faire face \u00e0 des sc\u00e9narios de placement impr\u00e9visibles<\/h3>\n\n\n\n

Le probl\u00e8me des puces semi-conductrices manquantes ou mal plac\u00e9es pr\u00e9sente une vaste gamme de d\u00e9fis, entra\u00eenant de nombreuses variations dans leur placement\u2014varIANT en fonction de la localisation, de l’angle et de l’orientation. Les syst\u00e8mes traditionnels bas\u00e9s sur des r\u00e8gles ont du mal \u00e0 identifier et \u00e0 cat\u00e9goriser efficacement tous les types de placements d\u00e9fectueux en raison de la complexit\u00e9 et de la variabilit\u00e9 impliqu\u00e9es.<\/p>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n

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Solution<\/h2>\n\n\n\n
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Utilisation de l’IA pour l’inspection des plateaux de circuits int\u00e9gr\u00e9s<\/h3>\n\n\n\n

L’outil de segmentation de SolVision<\/a> utilise le traitement d’image par IA pour analyser les diff\u00e9rents sc\u00e9narios de placement des puces sur les plateaux de circuits int\u00e9gr\u00e9s. Gr\u00e2ce \u00e0 un entra\u00eenement rapide, le mod\u00e8le d’IA identifie et met en \u00e9vidence avec pr\u00e9cision les \u00e9carts dans le placement des puces, permettant une reconnaissance et une localisation pr\u00e9cises des puces anormalement plac\u00e9es avec une efficacit\u00e9 exceptionnelle.<\/p>\n\n\n\n

<\/div>\n\n\n\n
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Inspection par IA<\/a><\/h4>\n\n\n\n
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\"Results<\/figure>\n\n\n\n

OK<\/mark> = Placement correct<\/strong><\/strong><\/p>\n\n\n\n

NG Stack2<\/mark> =Placement incorrect (2 circuits int\u00e9gr\u00e9s se chevauchant)<\/strong><\/strong><\/p>\n\n\n\n

NG Stack3\u00a0<\/mark>= Placement incorrect (3 circuits int\u00e9gr\u00e9s se chevauchant)<\/strong><\/strong><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n

\n
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R\u00e9sultat<\/h2>\n\n\n\n
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<\/path><\/svg>Am\u00e9lioration de l’assurance qualit\u00e9 gr\u00e2ce \u00e0 des normes plus \u00e9lev\u00e9es dans le placement des puces<\/span><\/div>
<\/path><\/svg>Pr\u00e9cision de d\u00e9tection accrue pour les puces mal plac\u00e9es dans les plateaux de circuits int\u00e9gr\u00e9s<\/span><\/div>
<\/path><\/svg>Inspection rationalis\u00e9e des divers placements de puces<\/span><\/div><\/div>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n
\n
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<\/div>\n<\/div>\n <\/div><\/div>","protected":false},"excerpt":{"rendered":"

SolVision utilise l’IA pour am\u00e9liorer l’inspection des plateaux de circuits int\u00e9gr\u00e9s, garantissant une d\u00e9tection pr\u00e9cise et \u00e9levant les normes d’assurance qualit\u00e9 dans l’industrie des semi-conducteurs.<\/p>","protected":false},"author":875,"featured_media":61995,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-5f6009ef-2b72{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:50px}#gspb_heading-id-gsbp-5f6009ef-2b72 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-5f6009ef-2b72 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-5f6009ef-2b72{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gspb_text-id-gsbp-fa6ec577-bc74{font-size:20px;text-align:center!important;font-weight:500!important}.gspb_text-id-gsbp-fa6ec577-bc74 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