{"id":89173,"date":"2025-02-25T08:29:14","date_gmt":"2025-02-25T00:29:14","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89173"},"modified":"2025-02-25T08:29:57","modified_gmt":"2025-02-25T00:29:57","slug":"inspection-des-puces-semi-conductrices-emballees","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/inspection-des-puces-semi-conductrices-emballees\/","title":{"rendered":"Inspection des puces semi-conductrices emball\u00e9es"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">\u00c9tude de cas<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semi-conducteurs<\/a><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Inspection des puces semi-conductrices emball\u00e9es<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"apprentissage-non-supervise-par-ia-pour-la-detection-de-micro-defauts\"><strong><strong>Apprentissage non supervis\u00e9 par IA pour la d\u00e9tection de micro-d\u00e9fauts<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"couche-de-protection-externe-et-processus-d-emballage\"><strong>Couche de protection externe et processus d&#8217;emballage<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Les processus de d\u00e9coupe influencent directement la qualit\u00e9 des tranches semi-conductrices. Lors de la s\u00e9paration des tranches, des d\u00e9fauts tels que des fissures de surface peuvent appara\u00eetre. Une fois emball\u00e9es, les tranches sont fix\u00e9es dans un bo\u00eetier protecteur en plastique ou en c\u00e9ramique, ce qui complique l&#8217;inspection des fissures sur les bords ou d&#8217;autres micro-d\u00e9fauts internes avec les m\u00e9thodes traditionnelles.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/shutterstock_1169020207_%E6%99%B6%E5%9C%93_S-600x400.jpg\" alt=\"AI unsupervised learning for detecting micro defects\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"detection-a-travers-l-emballage\"><strong>D\u00e9tection \u00e0 travers l\u2019emballage<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Lorsqu&#8217;une tranche est dans son emballage, elle ne peut \u00eatre photographi\u00e9e qu&#8217;\u00e0 l&#8217;aide d&#8217;une source lumineuse sp\u00e9ciale et de lentilles \u00e0 propri\u00e9t\u00e9s de p\u00e9n\u00e9tration. Cela g\u00e9n\u00e8re des images o\u00f9 les fissures sur les bords et les contours apparaissent dans des couleurs tr\u00e8s similaires, rendant leur distinction difficile. De plus, la forme et l&#8217;angle des petites fissures sont irr\u00e9guliers, ce qui rend les syst\u00e8mes d&#8217;inspection traditionnels bas\u00e9s sur des r\u00e8gles inefficaces pour ces t\u00e2ches.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"evaluation-des-produits-parfaits-et-imparfaits\"><strong>\u00c9valuation des produits parfaits et imparfaits<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Gr\u00e2ce \u00e0 l&#8217;IA, <a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/products\/solvision\/\">SolVision<\/a> propose des fonctions sp\u00e9cifiques pour compl\u00e9ter diverses t\u00e2ches d&#8217;inspection. L&#8217;outil de d\u00e9tection d&#8217;anomalies utilise la technologie du deep learning pour entra\u00eener le mod\u00e8le d&#8217;IA \u00e0 partir d&#8217;images d\u2019\u00e9chantillons de tranches \u00ab parfaites \u00bb. L&#8217;outil d&#8217;augmentation de donn\u00e9es simule des \u00e9carts potentiels des tranches afin d&#8217;\u00e9largir la base de donn\u00e9es de sc\u00e9narios de production et de renforcer la capacit\u00e9 de reconnaissance. Une fois entra\u00een\u00e9, le mod\u00e8le d&#8217;IA peut comparer l\u2019\u00e9chantillon de r\u00e9f\u00e9rence avec une image num\u00e9ris\u00e9e pour identifier et localiser des d\u00e9fauts, tels que des microfissures sur le bord d&#8217;une puce encapsul\u00e9e, sans \u00eatre affect\u00e9 par la qualit\u00e9 de l&#8217;imagerie ou par des couleurs presque identiques.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspection-par-ia\"><strong><strong><strong><strong>Inspection par IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<div class=\"wp-block-group eplus-wrapper is-content-justification-space-between is-nowrap is-layout-flex wp-container-core-group-is-layout-b0ffac9c wp-block-group-is-layout-flex\">\n<p class=\"eplus-wrapper wp-block-paragraph\"><strong>Image Num\u00e9ris\u00e9e<\/strong><\/p>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><strong>R\u00e9sultat de D\u00e9tection<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-group eplus-wrapper is-content-justification-space-between is-nowrap is-layout-flex wp-container-core-group-is-layout-b0ffac9c wp-block-group-is-layout-flex\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C2-1-1-200x263.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C%E9%A1%AF%E7%A4%BA%E7%91%95%E7%96%B52-1-1-200x263.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group eplus-wrapper is-content-justification-space-between is-nowrap is-layout-flex wp-container-core-group-is-layout-b0ffac9c wp-block-group-is-layout-flex\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C3-1-1-200x258.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C%E9%A1%AF%E7%A4%BA%E7%91%95%E7%96%B53-1-1-200x258.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-group eplus-wrapper is-content-justification-space-between is-nowrap is-layout-flex wp-container-core-group-is-layout-b0ffac9c wp-block-group-is-layout-flex\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C1-1-1-200x257.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E4%BF%AE%E6%94%B9%E5%BE%8C%E9%A1%AF%E7%A4%BA%E7%91%95%E7%96%B51-1-1-200x257.jpg\" alt=\"Internal defect inspection case of packaged chip\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>L&#8217;outil de d\u00e9tection des anomalies utilise une technologie d&#8217;apprentissage profond pour enseigner au mod\u00e8le d&#8217;IA des exemples d&#8217;images de plaquettes \u00ab parfaites \u00bb.<\/p>","protected":false},"author":875,"featured_media":21688,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3620,3612,3600,3670,3688],"tags":[],"class_list":["post-89173","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-etudes-de-cas","category-controle-qualite","category-detection-de-defauts","category-semiconductors","category-solvision"],"acf":[],"lang":"fr","translations":{"fr":89173,"en":32275,"vi":93311,"tw":32465,"zh":57023,"jp":79038,"es":82569,"pt":86276,"de":87653,"tr":91069,"th":96444,"it":98244,"ko":94739},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89173","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/comments?post=89173"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/posts\/89173\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media\/21688"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/media?parent=89173"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/categories?post=89173"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/fr\/wp-json\/wp\/v2\/tags?post=89173"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}