{"id":89163,"date":"2025-02-24T17:50:15","date_gmt":"2025-02-24T09:50:15","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=89163"},"modified":"2025-02-24T17:50:51","modified_gmt":"2025-02-24T09:50:51","slug":"detection-des-defauts-decaillage-dans-le-decoupage-de-wafers","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/fr\/etudes-de-cas\/detection-des-defauts-decaillage-dans-le-decoupage-de-wafers\/","title":{"rendered":"D\u00e9tection des d\u00e9fauts d&#8217;\u00e9caillage dans le d\u00e9coupage de wafers"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">\u00c9tude de cas<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semi-conducteurs<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">D\u00e9tection des d\u00e9fauts d&#8217;\u00e9caillage dans le d\u00e9coupage de wafers<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"controle-de-qualite-des-dies-de-semi-conducteurs-avec-l-ia\"><strong><strong>Contr\u00f4le de qualit\u00e9 des dies de semi-conducteurs avec l&#8217;IA<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"reduction-de-la-taille-des-wafers-de-semi-conducteurs\"><strong>R\u00e9duction de la taille des wafers de semi-conducteurs<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Le sciage de <a href=\"https:\/\/fr.wikipedia.org\/wiki\/Wafer\" target=\"_blank\" rel=\"noopener\">wafers<\/a> permet de s\u00e9parer le wafer en dies individuels pour un traitement ult\u00e9rieur. Alors que l&#8217;\u00e9lectronique moderne exige des wafers plus fins, plus petits et plus l\u00e9gers, la r\u00e9duction des puces de wafer n\u00e9cessite des processus de d\u00e9coupe plus minutieux. Les chemins de coupe sont r\u00e9duits, les cristaux de silicium deviennent plus fragiles et les dommages caus\u00e9s par le sciage sont plus fr\u00e9quents.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E5%9C%96%E7%89%871-4-800x448.png\" alt=\"Quality control of semiconductor die with AI\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"imprevisibilite-des-fissures-sur-les-bords-des-dies\"><strong>Impr\u00e9visibilit\u00e9 des fissures sur les bords des dies<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Les bords fissur\u00e9s caus\u00e9s lors du sciage des wafers endommagent la r\u00e9sistance du wafer. Dans les cas graves, cela peut entra\u00eener une rupture lorsque la puce est soumise \u00e0 une contrainte lors des processus de production ult\u00e9rieurs. La localisation, la taille et la forme des fissures varient \u00e0 chaque fois, et <a href=\"https:\/\/en.wikipedia.org\/wiki\/Automated_optical_inspection\" target=\"_blank\" rel=\"noopener\">l&#8217;inspection optique traditionnelle<\/a> ne peut pas identifier avec pr\u00e9cision ces d\u00e9fauts impr\u00e9visibles.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"etablir-des-bases-pour-l-emballage-avec-l-ia\"><strong>\u00c9tablir des bases pour l&#8217;emballage avec l&#8217;IA<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Offrant une reconnaissance sup\u00e9rieure, <a href=\"https:\/\/solomon-3d.mesvr.tw\/fr\/products\/solvision\/\">SolVision<\/a> peut entra\u00eener un mod\u00e8le d&#8217;IA capable d&#8217;inspecter les wafers et de reconna\u00eetre les d\u00e9fauts de production gr\u00e2ce au traitement d&#8217;image. Le syst\u00e8me permet de d\u00e9tecter et de localiser automatiquement diff\u00e9rentes variations de bords \u00e9br\u00e9ch\u00e9s en temps r\u00e9el, r\u00e9duisant consid\u00e9rablement la possibilit\u00e9 de rupture lors des processus d&#8217;emballage ult\u00e9rieurs.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspection-par-ia\"><strong><strong><strong><strong>Inspection par IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Bords fissur\u00e9s<\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%82_0806-600x317.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%822_0806.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>L&#8217;emplacement, la taille et la forme des fissures varient \u00e0 chaque fois, et l&#8217;inspection optique traditionnelle ne peut pas identifier avec pr\u00e9cision ces d\u00e9fauts impr\u00e9visibles.<\/p>","protected":false},"author":875,"featured_media":56103,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, 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