{"id":83186,"date":"2024-12-20T15:50:02","date_gmt":"2024-12-20T07:50:02","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=83186"},"modified":"2024-12-20T15:52:02","modified_gmt":"2024-12-20T07:52:02","slug":"quality-control-of-wafer-dicing","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/es\/casos-de-exito\/quality-control-of-wafer-dicing\/","title":{"rendered":"Control de calidad del corte en cubitos de obleas"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1600\" height=\"1047\" class=\"wp-block-cover__image-background wp-image-56108\" alt=\"pink green and blue square pattern\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm.jpg 1600w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm-300x196.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/qox9ksvpqcm-768x503.jpg 768w\" sizes=\"(max-width: 1600px) 100vw, 1600px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Estudio de casos<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"\/es\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\"><span style=\"\"><a _msttexthash=\"293553\" _msthash=\"438\" href=\"\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semiconductores<\/a><\/span><\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Control de calidad del corte en cubitos de obleas<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"inspeccion-con-ia-de-los-defectos-de-la-cuchilla-de-corte\"><strong><strong _msttexthash=\"1935388\" _msthash=\"442\"><strong><strong _msttexthash=\"1935388\" _msthash=\"442\">Inspecci\u00f3n con IA de los defectos de la cuchilla de corte<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"calidad-de-las-cuchillas-y-herramientas-para-cortar-en-cubitos-de-obleas\"><strong _msttexthash=\"3119064\" _msthash=\"447\"><strong _msttexthash=\"3119064\" _msthash=\"447\">Calidad de las cuchillas y herramientas para cortar en cubitos de obleas<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">El r\u00e1pido desarrollo de los productos electr\u00f3nicos modernos ha intensificado la demanda y los requisitos de calidad de <a _istranslated=\"1\" href=\"https:\/\/en.wikipedia.org\/wiki\/Semiconductor\" target=\"_blank\" rel=\"noopener\"><strong _istranslated=\"1\">los semiconductores<\/strong><\/a> patatas fritas. Los avances en la tecnolog\u00eda de fabricaci\u00f3n tambi\u00e9n han hecho que las obleas de silicio sean m\u00e1s ligeras, m\u00e1s delgadas y m\u00e1s cortas. Para lograr un alto rendimiento y optimizar el rendimiento de la producci\u00f3n, las t\u00e9cnicas de corte y singulaci\u00f3n de obleas son un aspecto importante a monitorear, y la clave para la calidad del corte en cubitos radica en la cuchilla utilizada y su control.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E5%8F%B0%E7%A9%8D%E9%9B%BB_02%E6%AA%A2%E6%B8%AC-600x304.png\" alt=\"AI inspection of dicing blade defects\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"patrones-de-hojas-circulares-y-fondos-complejos\"><strong _msttexthash=\"1552148\" _msthash=\"456\"><strong _msttexthash=\"1552148\" _msthash=\"456\">Patrones de hojas circulares y fondos complejos<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">El corte en cubitos de <a _istranslated=\"1\" href=\"https:\/\/en.wikipedia.org\/wiki\/Wafer_(electronics)\" target=\"_blank\" rel=\"noopener\"><strong _istranslated=\"1\">obleas<\/strong><\/a> es un proceso com\u00fan en las industrias de semiconductores y optoelectr\u00f3nica. Cuando el proceso de corte en cubitos no puede mantener el rendimiento y la eficiencia sin comprometer las caracter\u00edsticas de las virutas, la capacidad de producci\u00f3n se ver\u00e1 muy afectada. El control de calidad de las cuchillas para cortar en cubitos de obleas se lleva a cabo principalmente mediante la inspecci\u00f3n de deficiencias de apariencia. Las cuchillas da\u00f1adas a menudo tienen l\u00edneas irregulares o defectos de perforaci\u00f3n m\u00faltiple en su superficie. Los patrones densos en forma de anillo en las cuchillas de corte tambi\u00e9n forman fondos complejos que afectan las tasas de detecci\u00f3n de los sistemas de inspecci\u00f3n tradicionales.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"inspecciones-visuales-basadas-en-ia\"><strong _msttexthash=\"902278\" _msthash=\"461\"><strong _msttexthash=\"902278\" _msthash=\"461\">Inspecciones visuales basadas en IA<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Con la herramienta de segmentaci\u00f3n de <a href=\"https:\/\/solomon-3d.mesvr.tw\/es\/products\/solvision\"><strong _istranslated=\"1\">SolVision<\/strong><\/a>, las l\u00edneas irregulares y los defectos de perforaci\u00f3n m\u00faltiple se etiquetan en im\u00e1genes de muestra para entrenar el modelo de IA. Al aprovechar los potentes algoritmos y la tecnolog\u00eda avanzada de visi\u00f3n artificial, SolVision puede identificar varios defectos en las cuchillas de corte en cubitos de obleas en tiempo real para mantener su calidad, sin ser afectado por la complejidad de los antecedentes o defectos.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspeccion-de-ia\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"466\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"466\">Inspecci\u00f3n de IA<\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"276185\" _msthash=\"470\"><strong _msttexthash=\"276185\" _msthash=\"470\">Imagen escaneada<\/strong><\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2021-07-16_11h15_31.png\" alt=\"Wafer dicing knife defect detection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"569595\" _msthash=\"476\"><strong _msttexthash=\"569595\" _msthash=\"476\">Resultado de la detecci\u00f3n<\/strong><\/strong><\/p>\n\n\n\n<figure class=\"wp-block-image size-full eplus-wrapper\"><img decoding=\"async\" width=\"754\" height=\"754\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121.jpg\" alt=\"Wafer dicing knife defect detection case\" class=\"wp-image-55690\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121.jpg 754w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/image-121-300x300.jpg 300w\" sizes=\"(max-width: 754px) 100vw, 754px\" \/><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Usando la herramienta de segmentaci\u00f3n de instancias de SolVision, se etiquetan l\u00edneas irregulares y defectos de perforaci\u00f3n m\u00faltiple en im\u00e1genes de muestra para entrenar el modelo de IA.<\/p>","protected":false},"author":14,"featured_media":55690,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3003,2995,3017,3053,3065],"tags":[],"class_list":["post-83186","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-casos-de-exito","category-deteccion-de-defectos","category-inspeccion-de-calidad","category-semiconductors","category-solvision"],"acf":[],"lang":"es","translations":{"es":83186,"en":32273,"tw":32463,"zh":57078,"jp":78877,"pt":86925,"de":88944,"fr":89602,"tr":91055,"vi":91931,"th":96759,"it":98153,"ko":95830},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/83186","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/users\/14"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/comments?post=83186"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/83186\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media\/55690"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media?parent=83186"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/categories?post=83186"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/tags?post=83186"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}