{"id":82545,"date":"2024-12-16T16:29:02","date_gmt":"2024-12-16T08:29:02","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=82545"},"modified":"2024-12-20T14:31:53","modified_gmt":"2024-12-20T06:31:53","slug":"detecting-chipping-defects-in-wafer-dicing","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/es\/casos-de-exito\/solvision\/detecting-chipping-defects-in-wafer-dicing\/","title":{"rendered":"Detecci\u00f3n de defectos de astillas al cortar obleas en cubitos"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Estudio de casos<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><span style=\"\"><a href=\"\/es\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Semiconductores<\/a><\/span><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Detecci\u00f3n de defectos de astillas al cortar obleas en cubitos<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"control-de-calidad-de-matrices-de-semiconductores-con-ia\"><strong><strong _msttexthash=\"1971255\" _msthash=\"443\"><strong><strong _msttexthash=\"1971255\" _msthash=\"443\">Control de calidad de matrices de semiconductores con IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"reduccion-del-tamano-de-la-oblea-semiconductora\"><strong _msttexthash=\"1583361\" _msthash=\"448\"><strong _msttexthash=\"1583361\" _msthash=\"448\">Reducci\u00f3n del tama\u00f1o de la oblea semiconductora<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">El aserrado de <a _istranslated=\"1\" href=\"https:\/\/en.wikipedia.org\/wiki\/Wafer_(electronics)\" target=\"_blank\" rel=\"noopener\"><strong _istranslated=\"1\">obleas<\/strong><\/a> ayuda a individualizar la oblea en un troquel individual para su posterior procesamiento. A medida que la electr\u00f3nica moderna requiere obleas m\u00e1s delgadas, m\u00e1s peque\u00f1as y m\u00e1s livianas, los chips de obleas retr\u00e1ctiles requieren procesos de corte m\u00e1s meticulosos. Las v\u00edas de corte se estrechan, los cristales de silicio se vuelven m\u00e1s fr\u00e1giles y los da\u00f1os inducidos por el aserrado son m\u00e1s frecuentes.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E5%9C%96%E7%89%871-4-800x448.png\" alt=\"Quality control of semiconductor die with AI\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"imprevisibilidad-del-agrietamiento-del-borde-de-la-matriz\"><strong _msttexthash=\"2166138\" _msthash=\"457\"><strong _msttexthash=\"2166138\" _msthash=\"457\">Imprevisibilidad del agrietamiento del borde de la matriz<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Los bordes agrietados causados durante el corte en cubitos de la oblea da\u00f1an la resistencia de la oblea. En casos graves, puede provocar roturas cuando el chip se somete a tensiones en procesos de producci\u00f3n posteriores. La ubicaci\u00f3n, el tama\u00f1o y la forma de las grietas var\u00edan cada vez, y la <a _istranslated=\"1\" href=\"https:\/\/en.wikipedia.org\/wiki\/Automated_optical_inspection\" target=\"_blank\" rel=\"noopener\"><strong _istranslated=\"1\">inspecci\u00f3n \u00f3ptica tradicional<\/strong><\/a> no puede identificar con precisi\u00f3n estos defectos impredecibles.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"sentando-las-bases-para-el-packaging-con-ia\"><strong _msttexthash=\"1163578\" _msthash=\"462\"><strong _msttexthash=\"1163578\" _msthash=\"462\">Sentando las bases para el packaging con IA<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Ofreciendo un reconocimiento superior, <a href=\"https:\/\/solomon-3d.mesvr.tw\/es\/products\/solvision\/\"><strong _istranslated=\"1\">SolVision<\/strong><\/a> puede entrenar un modelo de IA capaz de inspeccionar obleas y reconocer defectos de producci\u00f3n mediante el procesamiento de im\u00e1genes. El sistema permite detectar autom\u00e1ticamente y localizar en tiempo real diferentes variaciones de bordes astillados, reduciendo en gran medida la posibilidad de rotura en procesos de envasado posteriores.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspeccion-de-ia\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"467\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"467\">InsInspecci\u00f3n de IA<\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"467\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"467\">pecci\u00f3n de IA<\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/p>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"318097\" _msthash=\"469\"><strong _msttexthash=\"318097\" _msthash=\"469\">Bordes agrietados<\/strong><\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%82_0806-600x317.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%822_0806.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>La ubicaci\u00f3n, el tama\u00f1o y la forma de las grietas var\u00edan cada vez, y la inspecci\u00f3n \u00f3ptica tradicional no puede identificar con precisi\u00f3n estos defectos impredecibles.<\/p>","protected":false},"author":14,"featured_media":56103,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3065,3003,2995,3017,3053],"tags":[],"class_list":["post-82545","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-solvision","category-casos-de-exito","category-deteccion-de-defectos","category-inspeccion-de-calidad","category-semiconductors"],"acf":[],"lang":"es","translations":{"es":82545,"en":32274,"tw":32464,"zh":57064,"jp":78891,"pt":86268,"de":87643,"fr":89163,"vi":93278,"tr":91039,"th":96440,"it":98242,"ko":94733},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/82545","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/users\/14"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/comments?post=82545"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/82545\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media\/56103"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media?parent=82545"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/categories?post=82545"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/tags?post=82545"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}