{"id":81615,"date":"2024-11-25T17:20:31","date_gmt":"2024-11-25T09:20:31","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=81615"},"modified":"2024-12-20T10:32:04","modified_gmt":"2024-12-20T02:32:04","slug":"inspecting-semiconductor-packaging-processes","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/es\/casos-de-exito\/inspecting-semiconductor-packaging-processes\/","title":{"rendered":"Inspecci\u00f3n de procesos de empaquetado de semiconductores"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1600\" height=\"1067\" class=\"wp-block-cover__image-background wp-image-56294\" alt=\"Central Processor Of A Computer\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463.jpg 1600w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463-300x200.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463-768x512.jpg 768w\" sizes=\"(max-width: 1600px) 100vw, 1600px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Estudio de casos<\/span><\/h2>\n\n\n\n<div id=\"gspb_text-id-gsbp-c3844e90-556c\" class=\"gspb_text gspb_text-id-gsbp-c3844e90-556c\"><span style=\"\"><span style=\"\"><a href=\"\/es\/category\/case-studies\/semiconductors\/\">Semiconductores<\/a><\/span><\/span><\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Inspecci\u00f3n de procesos de empaquetado de semiconductores<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"tecnologia-avanzada-de-deteccion-de-defectos-con-ia\"><strong><strong _msttexthash=\"1745614\" _msthash=\"431\"><strong><strong _msttexthash=\"1745614\" _msthash=\"431\">Tecnolog\u00eda avanzada de detecci\u00f3n de defectos con IA<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"proceso-de-union-de-matrices-de-semiconductores\"><strong><strong><strong _msttexthash=\"1574313\" _msthash=\"436\"><strong><strong><strong _msttexthash=\"1574313\" _msthash=\"436\">Proceso de uni\u00f3n de matrices de semiconductores <\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">La uni\u00f3n de troqueles (o montaje de troqueles) es un paso importante en el empaquetado de semiconductores, que requiere la adhesi\u00f3n del chip de silicio al marco de plomo para formar una ruta t\u00e9rmica o el\u00e9ctrica. Como tal, la precisi\u00f3n del proceso de uni\u00f3n de matrices es clave para la calidad y el rendimiento de los semiconductores. <\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/djiasjfio-600x338.png\" alt=\"Advanced AI defect detection technology\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"los-puntos-debiles-de-las-inspecciones-convencionales\"><strong><strong _msttexthash=\"1984359\" _msthash=\"445\"><strong><strong _msttexthash=\"1984359\" _msthash=\"445\">Los puntos d\u00e9biles de las inspecciones convencionales<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">La uni\u00f3n de troqueles es una prioridad cuando se empaquetan semiconductores, y la ejecuci\u00f3n requiere una velocidad y precisi\u00f3n excepcionales. Debido a la complejidad de las im\u00e1genes capturadas, los sistemas de visi\u00f3n basados en reglas a menudo no pueden establecer reglas para detectar de manera flexible un gran n\u00famero de defectos aleatorios, como en este caso el \u00e1ngulo o la posici\u00f3n desviaciones, componentes deformes o faltantes. Las inspecciones omitidas y los errores de juicio son inevitables y afectan la productividad del proceso de embalaje. <\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"optimizacion-con-ia-de-los-procesos-de-empaquetado-de-semiconductores\"><strong><strong _msttexthash=\"3060317\" _msthash=\"450\"><strong><strong _msttexthash=\"3060317\" _msthash=\"450\">Optimizaci\u00f3n con IA de los procesos de empaquetado de semiconductores<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/es\/products\/solvision\/\"><strong _istranslated=\"1\">SolVision<\/strong><\/a> permite la inspecci\u00f3n visual a trav\u00e9s del an\u00e1lisis de im\u00e1genes de IA, lo que fortalece la confiabilidad de la informaci\u00f3n de desplazamiento y \u00e1ngulo para reconocer productos defectuosos y errores en el proceso de uni\u00f3n de troqueles. Adem\u00e1s, el modelo de IA puede absorber datos sobre diferentes estructuras de chips y ampliar las inspecciones a m\u00faltiples tipos de paquetes de semiconductores.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"inspeccion-de-ia\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"455\"><strong><strong><strong><strong _msttexthash=\"262756\" _msthash=\"455\">Inspecci\u00f3n de IA<\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"223236\" _msthash=\"459\"><strong _msttexthash=\"223236\" _msthash=\"459\">Muestra Dorada<\/strong><\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"476892\" _msthash=\"462\"><strong _msttexthash=\"476892\" _msthash=\"462\">Desviaci\u00f3n del \u00e1ngulo<\/strong><\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong _msttexthash=\"262223\" _msthash=\"465\"><strong _msttexthash=\"262223\" _msthash=\"465\">Desplazamiento<\/strong><\/strong><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E5%8D%97%E8%8C%82_%E6%9B%B4%E6%96%B0%E7%89%880806-scaled.jpg\" alt=\"Visual Inspection for Semiconductor Packaging Processes\" title=\"\"><\/figure>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>Solvision permite la inspecci\u00f3n visual a trav\u00e9s del an\u00e1lisis de im\u00e1genes con IA, fortaleciendo la fiabilidad de la informaci\u00f3n de desplazamiento y \u00e1ngulo para reconocer productos defectuosos y errores en el proceso de uni\u00f3n de matrices.<\/p>","protected":false},"author":14,"featured_media":56294,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:50px}#gspb_heading-id-gsbp-98a71402-b1a0 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.gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3003,2995,3053,3065],"tags":[],"class_list":["post-81615","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-casos-de-exito","category-deteccion-de-defectos","category-semiconductors","category-solvision"],"acf":[],"lang":"es","translations":{"es":81615,"en":32242,"tw":32447,"zh":56903,"jp":78517,"pt":86486,"de":88434,"fr":89356,"tr":90539,"vi":91643,"th":96910,"it":97814,"ko":95022},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/81615","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/users\/14"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/comments?post=81615"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/posts\/81615\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media\/56294"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/media?parent=81615"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/categories?post=81615"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/es\/wp-json\/wp\/v2\/tags?post=81615"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}