{"id":88434,"date":"2025-02-20T15:41:17","date_gmt":"2025-02-20T07:41:17","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=88434"},"modified":"2025-02-20T15:41:50","modified_gmt":"2025-02-20T07:41:50","slug":"inspektion-von-halbleiterverpackungsprozessen","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/de\/anwenderberichte\/inspektion-von-halbleiterverpackungsprozessen\/","title":{"rendered":"Inspektion von Halbleiterverpackungsprozessen"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1600\" height=\"1067\" class=\"wp-block-cover__image-background wp-image-56294\" alt=\"Central Processor Of A Computer\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463.jpg 1600w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463-300x200.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/6636463-768x512.jpg 768w\" sizes=\"(max-width: 1600px) 100vw, 1600px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Fallstudie<\/span><\/h2>\n\n\n\n<div id=\"gspb_text-id-gsbp-c3844e90-556c\" class=\"gspb_text gspb_text-id-gsbp-c3844e90-556c\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Halbleiter<\/a><\/span><\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Inspektion von Halbleiterverpackungsprozessen<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"fortschrittliche-ki-gestutzte-fehlererkennungstechnologie\"><strong><strong>Fortschrittliche KI-gest\u00fctzte Fehlererkennungstechnologie<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"halbleiter-die-bonding-prozess\"><strong><strong><strong>Halbleiter-Die-Bonding-Prozess\u00a0<\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Das Die-Bonding (oder Die-Mounting) ist ein wichtiger Schritt in der Halbleiterverpackung, bei dem der Siliziumchip am Leadframe befestigt wird, um einen thermischen oder elektrischen Pfad zu schaffen. Daher ist die Genauigkeit des Die-Bonding-Prozesses entscheidend f\u00fcr die Qualit\u00e4t und den Ertrag von Halbleitern.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/djiasjfio-600x338.png\" alt=\"Advanced AI defect detection technology\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"die-schwachen-konventioneller-inspektionsmethoden\"><strong><strong>Die Schw\u00e4chen konventioneller Inspektionsmethoden<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Das Die-Bonding ist eine Priorit\u00e4t bei der Verpackung von Halbleitern und erfordert au\u00dfergew\u00f6hnliche Geschwindigkeit und Pr\u00e4zision. Aufgrund der Komplexit\u00e4t der erfassten Bilder k\u00f6nnen regelbasierte Bildverarbeitungssysteme oft keine flexiblen Regeln zur Erkennung einer gro\u00dfen Anzahl zuf\u00e4lliger Defekte festlegen, wie beispielsweise Winkel- oder Positionsabweichungen, deformierte oder fehlende Komponenten. Fehlende Inspektionen und Fehleinsch\u00e4tzungen sind unvermeidlich und beeintr\u00e4chtigen die Produktivit\u00e4t des Verpackungsprozesses.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"ai-optimierung-von-halbleiterverpackungsprozessen\"><strong><strong>AI-Optimierung von Halbleiterverpackungsprozessen<\/strong><\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/products\/solvision\/\">SolVision<\/a> erm\u00f6glicht die visuelle Inspektion durch KI-Bildanalyse und st\u00e4rkt die Zuverl\u00e4ssigkeit von Versatz- und Winkelinformationen, um fehlerhafte Produkte und Fehler im Die-Bonding-Prozess zu erkennen. Dar\u00fcber hinaus kann das KI-Modell Daten \u00fcber verschiedene Chipstrukturen aufnehmen und die Inspektionen auf mehrere Arten von Halbleiterverpackungen ausweiten.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"ki-inspektion\"><strong><strong><strong><strong>KI-Inspektion<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Goldenes Muster<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Winkelabweichung<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Versatz<\/strong><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E5%8D%97%E8%8C%82_%E6%9B%B4%E6%96%B0%E7%89%880806-scaled.jpg\" alt=\"Visual Inspection for Semiconductor Packaging Processes\" title=\"\"><\/figure>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>SolVision erm\u00f6glicht die visuelle Inspektion durch KI-Bildanalyse, wodurch die Zuverl\u00e4ssigkeit von Versatz- und Winkelinformationen gest\u00e4rkt wird, um fehlerhafte Produkte und Fehler im Die-Bonding-Prozess zu erkennen.<\/p>","protected":false},"author":875,"featured_media":56294,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:50px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gspb_text-id-gsbp-c3844e90-556c{font-size:20px;text-align:center!important;font-weight:500!important;margin-bottom:0!important}.gspb_text-id-gsbp-c3844e90-556c .gsap-g-line{text-align:center!important}.gspb_text-id-gsbp-c3844e90-556c,.gspb_text-id-gsbp-c3844e90-556c .wp-block a,.gspb_text-id-gsbp-c3844e90-556c a{color:var(--wp--preset--color--white, #ffffff)}.gspb_text-id-gsbp-c3844e90-556c .wp-block a:hover,.gspb_text-id-gsbp-c3844e90-556c a:hover,.gspb_text-id-gsbp-c3844e90-556c:hover{color:var(--gs-colorone)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox{color:var(--wp--preset--color--black, #000000)}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox svg,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox svg{fill:var(--wp--preset--color--black, #000000)}.gs-titlebox .gs-title-inbox{display:flex;align-content:center;padding:15px 20px;font-weight:700;font-size:115%}.gs-titlebox .gs-title-inbox-label{flex-grow:1}.gs-titlebox .gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3349,3364,3378,3370],"tags":[],"class_list":["post-88434","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-anwenderberichte","category-fehlererkennung","category-semiconductors","category-solvision"],"acf":[],"lang":"de","translations":{"de":88434,"en":32242,"es":81615,"tw":32447,"zh":56903,"jp":78517,"pt":86486,"fr":89356,"tr":90539,"vi":91643,"th":96910,"it":97814,"ko":95022},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts\/88434","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/comments?post=88434"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts\/88434\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/media\/56294"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/media?parent=88434"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/categories?post=88434"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/tags?post=88434"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}