{"id":87701,"date":"2025-02-19T13:37:31","date_gmt":"2025-02-19T05:37:31","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=87701"},"modified":"2025-02-19T13:39:09","modified_gmt":"2025-02-19T05:39:09","slug":"bga-loetinspektion-mit-ki","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/de\/anwenderberichte\/bga-loetinspektion-mit-ki\/","title":{"rendered":"BGA-L\u00f6tinspektion mit KI"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim-60 has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"382\" height=\"312\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/bga-soldering-inspection-short-circuit-bridging.png\" class=\"wp-block-cover__image-background wp-post-image\" alt=\"AI-powered BGA soldering inspection identifying electrical bridging and short circuit defects between solder joints, highlighted with red indicators for quality assurance.\" data-object-fit=\"cover\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/bga-soldering-inspection-short-circuit-bridging.png 382w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/bga-soldering-inspection-short-circuit-bridging-300x245.png 300w\" sizes=\"(max-width: 382px) 100vw, 382px\" title=\"\"><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-5f6009ef-2b72\" class=\"gspb_heading gspb_heading-id-gsbp-5f6009ef-2b72\">SolVision<span class=\"gspb_heading_subtitle\">Fallstudie<\/span><\/h2>\n\n\n\n<div id=\"gspb_text-id-gsbp-fa6ec577-bc74\" class=\"gspb_text gspb_text-id-gsbp-fa6ec577-bc74\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/industries\/electronics\/\" target=\"_blank\" rel=\"noreferrer noopener\">Elektronik<\/a> | <a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/industries\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Halbleiter<\/a><\/div>\n<\/div><\/div>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">BGA-L\u00f6tinspektion mit KI<\/h1><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-1c111ca0-9553\" id=\"gspb_row-id-gsbp-1c111ca0-9553\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--12 gspb_col-id-gsbp-aa3cf9aa-1058\" id=\"gspb_col-id-gsbp-aa3cf9aa-1058\">\n<h2 id=\"gspb_heading-id-gsbp-466236d0-ac25\" class=\"gspb_heading gspb_heading-id-gsbp-466236d0-ac25\">Fall<\/h2>\n\n\n\n<div class=\"wp-block-greenshift-blocks-container gspb_container gspb_container-gsbp-df075655-2335\" id=\"gspb_container-id-gsbp-df075655-2335\">\n<h3 id=\"gspb_heading-id-gsbp-d1d4af1d-e2e9\" class=\"gspb_heading gspb_heading-id-gsbp-d1d4af1d-e2e9\"><br>Pr\u00e4zise BGA-L\u00f6tinspektion<\/h3>\n\n\n\n<p class=\"has-medium-font-size eplus-wrapper wp-block-paragraph\">Ball Grid Array (BGA) Technologie ist eine bevorzugte Verpackungsmethode f\u00fcr hochdichte und fortschrittliche Halbleiterchips, die darauf ausgelegt ist, elektrische Kurzschl\u00fcsse zu reduzieren und die Gesamtzuverl\u00e4ssigkeit zu verbessern. Dieser Ansatz verwendet ein Array kleiner L\u00f6tperlen auf der Unterseite des Geh\u00e4uses, um hochdichte elektrische Verbindungen zwischen dem BGA und der Leiterplatte (PCB) herzustellen. K\u00fcnstliche BGAs, die \u00fcblicherweise laminierte Substrate verwenden, bieten eine kosteng\u00fcnstige L\u00f6sung f\u00fcr die Hochvolumenproduktion, insbesondere in der Unterhaltungselektronik und anderen kostensensitiven Anwendungen. W\u00e4hrend des Reflow-L\u00f6tprozesses k\u00f6nnen jedoch Temperatur\u00e4nderungen zu Verformungen der PCB und des BGA f\u00fchren, was zu M\u00e4ngeln wie Nichtbenetzung, \u00dcberlappung von L\u00f6tperlen, kalten L\u00f6tstellen und Hohlr\u00e4umen f\u00fchrt \u2013 allesamt Ursachen f\u00fcr Kurzschl\u00fcsse oder geschw\u00e4chte Verbindungen. Eine pr\u00e4zise Inspektion ist entscheidend, um die Zuverl\u00e4ssigkeit und Funktionalit\u00e4t des Endprodukts zu gew\u00e4hrleisten.<\/p>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-fb7bc04\" id=\"gspb_row-id-gsbp-fb7bc04\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--12 gspb_col-id-gsbp-00dad7c\" id=\"gspb_col-id-gsbp-00dad7c\">\n<h2 id=\"gspb_heading-id-gsbp-42772ec\" class=\"gspb_heading gspb_heading-id-gsbp-42772ec\">Herausforderung<\/h2>\n\n\n\n<div class=\"wp-block-greenshift-blocks-container gspb_container gspb_container-gsbp-96ac342\" id=\"gspb_container-id-gsbp-96ac342\">\n<h3 id=\"gspb_heading-id-gsbp-c78d1d0\" class=\"gspb_heading gspb_heading-id-gsbp-c78d1d0\">Pr\u00e4zision bei der BGA-Fehlererkennung erreichen<\/h3>\n\n\n\n<p class=\"has-medium-font-size eplus-wrapper wp-block-paragraph\">Traditionelle optische Inspektionsmethoden sind oft unzureichend, um die L\u00f6tqualit\u00e4t bei BGAs zu \u00fcberpr\u00fcfen, insbesondere bei der dichten Anordnung der L\u00f6tballen auf der Unterseite. R\u00f6ntgenaufnahmen sind entscheidend, um das Geh\u00e4use zu durchdringen und potenzielle L\u00f6tfehler zu erkennen, die sich unter der Oberfl\u00e4che verbergen. Allerdings leiden R\u00f6ntgenbilder h\u00e4ufig unter erheblichem Hintergrundrauschen und weisen einen geringen Kontrast auf, was es Regel-basierten Systemen erschwert, Defekte genau zu erkennen und die L\u00f6tqualit\u00e4t zu bewerten.<\/p>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-bba6972e-d6a1\" id=\"gspb_row-id-gsbp-bba6972e-d6a1\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--12 gspb_col-id-gsbp-d480d4c9-3bd4\" id=\"gspb_col-id-gsbp-d480d4c9-3bd4\">\n<h2 id=\"gspb_heading-id-gsbp-a6c48e89-bced\" class=\"gspb_heading gspb_heading-id-gsbp-a6c48e89-bced\">L\u00f6sung<\/h2>\n\n\n\n<div class=\"wp-block-greenshift-blocks-container gspb_container gspb_container-gsbp-176430cc-7a4f\" id=\"gspb_container-id-gsbp-176430cc-7a4f\">\n<h3 id=\"gspb_heading-id-gsbp-36dba046-5566\" class=\"gspb_heading gspb_heading-id-gsbp-36dba046-5566\">KI-gest\u00fctzte Fehlererkennung f\u00fcr BGA-L\u00f6tverbindungen<\/h3>\n\n\n\n<p class=\"has-medium-font-size eplus-wrapper wp-block-paragraph\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/products\/solvision\/\">SolVision<\/a> nutzt Deep Learning, um sein KI-Modell mithilfe von gekennzeichneten Musterbildern von L\u00f6tfehlern wie Nichtbenetzung und \u00dcberlappung von L\u00f6tk\u00fcgelchen zu trainieren. Durch den Einsatz fortschrittlicher KI-Algorithmen identifiziert SolVision diese Fehler nicht nur mit hoher Pr\u00e4zision, sondern beschleunigt auch den Inspektionsprozess erheblich und sorgt f\u00fcr eine schnellere und zuverl\u00e4ssigere Qualit\u00e4tskontrolle. Das Modell ist darauf trainiert, subtile Fehler selbst in rauschenden und kontrastarmen R\u00f6ntgenbildern zu erkennen, was eine Herausforderung f\u00fcr traditionelle Inspektionssysteme darstellt. Dies f\u00fchrt zu einer genauen Fehlererkennung, die die Inspektionszuverl\u00e4ssigkeit erh\u00f6ht und Fehlalarme minimiert.<\/p>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-container gspb_container gspb_container-gsbp-02f2f641-7ddd\" id=\"gspb_container-id-gsbp-02f2f641-7ddd\">\n<h4 id=\"gspb_heading-id-gsbp-3a09d084-62e5\" class=\"gspb_heading gspb_heading-id-gsbp-3a09d084-62e5\">BGA-L\u00f6tfehlererkennung<\/h4>\n\n\n\n<div class=\"wp-block-columns are-vertically-aligned-center eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-center eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image is-resized\">\n<figure class=\"aligncenter eplus-wrapper\"><img decoding=\"async\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/2021-07-16_15h02_53.png\" alt=\"BGA soldering defect detection - OK\" class=\"wp-image-21895\" style=\"object-fit:cover;width:250px;height:250px\" title=\"BGA Soldering Defect Detection - OK\"\/><\/figure>\n<\/div>\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>OK<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-center eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image is-resized\">\n<figure class=\"aligncenter eplus-wrapper\"><img decoding=\"async\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/2021-07-16_15h03_02.png\" alt=\"BGA soldering defect detection - NG\" class=\"wp-image-21896\" style=\"object-fit:cover;width:250px;height:250px\" title=\"BGA Soldering Defect Detection - NG\"\/><\/figure>\n<\/div>\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>NG<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-center eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image is-resized\">\n<figure class=\"aligncenter eplus-wrapper\"><img decoding=\"async\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/2021-07-16_15h04_10.png\" alt=\"BGA soldering defect detection - wrong size\" class=\"wp-image-21900\" style=\"object-fit:cover;width:250px;height:250px\" title=\"BGA Soldering Defect Detection - Wrong Size\"\/><\/figure>\n<\/div>\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Falsche Gr\u00f6\u00dfe<\/strong><\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-center eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\"><div class=\"wp-block-image is-resized\">\n<figure class=\"aligncenter eplus-wrapper\"><img decoding=\"async\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/2021-07-16_15h04_49.png\" alt=\"BGA soldering defect detection - short circuit\" class=\"wp-image-21899\" style=\"object-fit:cover;width:250px;height:250px\" title=\"BGA Soldering Defect Detection - Short Circuit\"\/><\/figure>\n<\/div>\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Kurzschluss<\/strong><\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-d42f33aa-ff0f\" id=\"gspb_row-id-gsbp-d42f33aa-ff0f\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--12 gspb_col-id-gsbp-feef3728-2b03\" id=\"gspb_col-id-gsbp-feef3728-2b03\">\n<h2 id=\"gspb_heading-id-gsbp-db4f8a6d-2f77\" class=\"gspb_heading gspb_heading-id-gsbp-db4f8a6d-2f77\">Ergebnis<\/h2>\n\n\n\n<div class=\"wp-block-greenshift-blocks-container gspb_container gspb_container-gsbp-8c4eb2e6-78ce\" id=\"gspb_container-id-gsbp-8c4eb2e6-78ce\">\n<div class=\"wp-block-greenshift-blocks-iconlist gspb_iconsList gspb_iconsList-id-gsbp-b8944452-67c0\" id=\"gspb_iconsList-id-gsbp-b8944452-67c0\"><div class=\"gspb_iconsList__item\" data-id=\"0\"><svg class=\"\" style=\"display:inline-block;vertical-align:middle\" width=\"18\" height=\"18\" viewbox=\"0 0 1024 1024\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path style=\"fill:#565D66\" d=\"M871.696 166.932l-526.088 526.088-193.304-193.304c-9.372-9.372-24.568-9.372-33.942 0l-56.568 56.568c-9.372 9.372-9.372 24.568 0 33.942l266.842 266.842c9.372 9.372 24.568 9.372 33.942 0l599.626-599.626c9.372-9.372 9.372-24.568 0-33.942l-56.568-56.568c-9.372-9.372-24.568-9.372-33.94 0z\"><\/path><\/svg><span class=\"gspb_iconsList__item__text\">Optimierte Qualit\u00e4tssicherung und verbesserte Verpackungszuverl\u00e4ssigkeit<\/span><\/div><div class=\"gspb_iconsList__item\" data-id=\"1\"><svg class=\"\" style=\"display:inline-block;vertical-align:middle\" width=\"18\" height=\"18\" viewbox=\"0 0 1024 1024\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path style=\"fill:#565D66\" d=\"M871.696 166.932l-526.088 526.088-193.304-193.304c-9.372-9.372-24.568-9.372-33.942 0l-56.568 56.568c-9.372 9.372-9.372 24.568 0 33.942l266.842 266.842c9.372 9.372 24.568 9.372 33.942 0l599.626-599.626c9.372-9.372 9.372-24.568 0-33.942l-56.568-56.568c-9.372-9.372-24.568-9.372-33.94 0z\"><\/path><\/svg><span class=\"gspb_iconsList__item__text\">Erh\u00f6hte Genauigkeit der Fehlererkennung bei BGA-L\u00f6tstellen<\/span><\/div><div class=\"gspb_iconsList__item\" data-id=\"2\"><svg class=\"\" style=\"display:inline-block;vertical-align:middle\" width=\"18\" height=\"18\" viewbox=\"0 0 1024 1024\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path style=\"fill:#565D66\" d=\"M871.696 166.932l-526.088 526.088-193.304-193.304c-9.372-9.372-24.568-9.372-33.942 0l-56.568 56.568c-9.372 9.372-9.372 24.568 0 33.942l266.842 266.842c9.372 9.372 24.568 9.372 33.942 0l599.626-599.626c9.372-9.372 9.372-24.568 0-33.942l-56.568-56.568c-9.372-9.372-24.568-9.372-33.94 0z\"><\/path><\/svg><span class=\"gspb_iconsList__item__text\">FaSchnellere Inspektionen zur Steigerung der Produktionseffizienz<\/span><\/div><\/div>\n<\/div>\n<\/div>\n <\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-row gspb_row gspb_row-id-gsbp-3cb13f4\" id=\"gspb_row-id-gsbp-3cb13f4\"><div class=\"gspb_row__content\"> \n<div class=\"wp-block-greenshift-blocks-row-column gspb_row__col--12 gspb_col-id-gsbp-9c36711\" id=\"gspb_col-id-gsbp-9c36711\">\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n<\/div>\n <\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>SolVision KI erkennt BGA-L\u00f6tfehler mit hoher Pr\u00e4zision und verbessert die Fehlererkennung, Inspektionsgenauigkeit und Qualit\u00e4tssicherung f\u00fcr Hersteller.<\/p>","protected":false},"author":875,"featured_media":103054,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-5f6009ef-2b72{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:50px}#gspb_heading-id-gsbp-5f6009ef-2b72 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-5f6009ef-2b72 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-5f6009ef-2b72{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gspb_text-id-gsbp-fa6ec577-bc74{font-size:20px;text-align:center!important;font-weight:500!important;margin-bottom:0!important}.gspb_text-id-gsbp-fa6ec577-bc74 .gsap-g-line{text-align:center!important}.gspb_text-id-gsbp-fa6ec577-bc74,.gspb_text-id-gsbp-fa6ec577-bc74 .wp-block a,.gspb_text-id-gsbp-fa6ec577-bc74 a{color:var(--wp--preset--color--white, 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