{"id":87643,"date":"2025-02-19T10:41:50","date_gmt":"2025-02-19T02:41:50","guid":{"rendered":"https:\/\/solomon-3d.mesvr.tw\/?p=87643"},"modified":"2025-02-19T10:42:24","modified_gmt":"2025-02-19T02:42:24","slug":"erkennung-von-abplatzfehlern-beim-wafer-dicing","status":"publish","type":"post","link":"https:\/\/solomon-3d.mesvr.tw\/de\/anwenderberichte\/erkennung-von-abplatzfehlern-beim-wafer-dicing\/","title":{"rendered":"Erkennung von Abplatzfehlern beim Wafer-Dicing"},"content":{"rendered":"<div class=\"post-title-custom-background wp-block-group alignfull has-white-color has-text-color has-link-color eplus-wrapper wp-elements-1\" style=\"margin-top:0;margin-bottom:0;padding-top:0;padding-right:0;padding-bottom:0;padding-left:0\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-container-core-group-is-layout-3110c56b wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-cover alignfull eplus-wrapper\" style=\"margin-top:0;margin-bottom:0;padding-top:var(--wp--preset--spacing--50);padding-right:var(--wp--preset--spacing--20);padding-bottom:var(--wp--preset--spacing--50);padding-left:var(--wp--preset--spacing--20);min-height:220px;aspect-ratio:unset;\"><span aria-hidden=\"true\" class=\"wp-block-cover__background has-black-background-color has-background-dim\"><\/span><img fetchpriority=\"high\" decoding=\"async\" width=\"1555\" height=\"1200\" class=\"wp-block-cover__image-background wp-image-56103\" alt=\"a group of square objects\" src=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg\" data-object-fit=\"cover\" title=\"\" srcset=\"https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca.jpg 1555w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-300x232.jpg 300w, https:\/\/solomon-3d.mesvr.tw\/wp-content\/uploads\/inphxuo4xca-768x593.jpg 768w\" sizes=\"(max-width: 1555px) 100vw, 1555px\" \/><div class=\"wp-block-cover__inner-container is-layout-flow wp-block-cover-is-layout-flow\">\n<h2 id=\"gspb_heading-id-gsbp-98a71402-b1a0\" class=\"gspb_heading gspb_heading-id-gsbp-98a71402-b1a0\">SolVision<span class=\"gspb_heading_subtitle\">Fallstudie<\/span><\/h2>\n\n\n\n<div class=\"case-category wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><span style=\"\"><a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/category\/case-studies\/semiconductors\/\" target=\"_blank\" rel=\"noreferrer noopener\">Halbleiter<\/a><\/span><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n<h1 class=\"has-text-align-center wp-block-post-title has-text-color has-black-color has-large-font-size\">Erkennung von Abplatzfehlern beim Wafer-Dicing<\/h1><\/div><\/div>\n\n\n\n<h2 class=\"wp-block-heading has-text-align-center eplus-wrapper\" id=\"qualitatskontrolle-von-halbleiter-dies-mit-ki\"><strong><strong>Qualit\u00e4tskontrolle von Halbleiter-Dies mit KI<\/strong><\/strong><\/h2>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer eplus-wrapper\"><\/div>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"reduzierung-der-halbleiter-wafergro\u00dfe\"><strong>Reduzierung der Halbleiter-Wafergr\u00f6\u00dfe<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Das <a href=\"https:\/\/de.wikipedia.org\/wiki\/Wafer\" target=\"_blank\" rel=\"noopener\">Wafer<\/a>-S\u00e4gen hilft, den Wafer in einzelne Dies f\u00fcr die anschlie\u00dfende Verarbeitung zu trennen. Da moderne Elektronik d\u00fcnnere, kleinere und leichtere Wafer ben\u00f6tigt, erfordert das Verkleinern von Wafer-Chips genauere Schneidprozesse. Die Schneidwege werden verengt, die Siliziumkristalle werden fragiler, und schneidungsbedingte Sch\u00e4den sind h\u00e4ufiger anzutreffen.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E5%9C%96%E7%89%871-4-800x448.png\" alt=\"Quality control of semiconductor die with AI\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-d7f236a4-825c\" id=\"gspb_titleBox-id-gsbp-d7f236a4-825c\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"unvorhersehbarkeit-von-rissbildung-an-den-kanten-von-dies\"><strong>Unvorhersehbarkeit von Rissbildung an den Kanten von Dies<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Risse an den Kanten, die w\u00e4hrend des Wafer-Dicings entstehen, beeintr\u00e4chtigen die Festigkeit des Wafers. In schweren F\u00e4llen kann dies zu Bruch f\u00fchren, wenn der Chip in nachfolgenden Produktionsprozessen belastet wird. Die Lage, Gr\u00f6\u00dfe und Form der Risse variieren dabei jedes Mal, und <a href=\"https:\/\/de.wikipedia.org\/wiki\/Automatische_optische_Inspektion\" target=\"_blank\" rel=\"noopener\">traditionelle optische Inspektionen<\/a> k\u00f6nnen solche unvorhersehbaren Fehler nicht genau identifizieren.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<div class=\"wp-block-greenshift-blocks-titlebox gspb_titleBox gspb_titleBox-id-gsbp-0deb1d81-48a5\" id=\"gspb_titleBox-id-gsbp-0deb1d81-48a5\"><div class=\"gs-titlebox\"><div class=\"gs-title-inbox\"><div class=\"gs-titlebox-icon\"><\/div><div class=\"gs-title-inbox-label\"><\/div><\/div><div class=\"gs-titlebox-text\">\n<h2 class=\"wp-block-heading eplus-wrapper\" id=\"fundamentlegung-fur-verpackungen-mit-ki\"><strong>Fundamentlegung f\u00fcr Verpackungen mit KI<\/strong><\/h2>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\">Mit \u00fcberlegenen Erkennungsf\u00e4higkeiten kann <a href=\"https:\/\/solomon-3d.mesvr.tw\/de\/products\/solvision\/\">SolVision<\/a> ein KI-Modell trainieren, das Wafer inspiziert und Produktionsfehler durch Bildverarbeitung erkennt. Das System erm\u00f6glicht die automatische Erkennung und Lokalisierung verschiedener Variationen von abgebrochenen Kanten in Echtzeit, wodurch die M\u00f6glichkeit von Bruch in sp\u00e4teren Verpackungsprozessen erheblich reduziert wird.<\/p>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<div class=\"wp-block-group eplus-wrapper\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<h2 class=\"wp-block-heading has-text-align-center has-black-color has-text-color eplus-wrapper\" id=\"ki-inspektion\"><strong><strong><strong><strong>KI-Inspektion<\/strong><\/strong><\/strong><\/strong><\/h2>\n\n\n\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><strong>Rissige Kanten<\/strong><\/p>\n\n\n\n<div class=\"wp-block-columns eplus-wrapper is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%82_0806-600x317.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column eplus-wrapper is-layout-flow wp-block-column-is-layout-flow\">\n<p class=\"has-text-align-center eplus-wrapper wp-block-paragraph\"><\/p>\n\n\n\n<figure class=\"wp-block-image size-large eplus-wrapper\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/%E7%B9%AA%E8%A3%BD_%E4%BA%9E%E4%BA%9E_IC%E5%88%87%E5%89%B2%E9%81%93_%E9%82%8A%E7%B7%A3%E5%B4%A9%E8%A3%822_0806.png\" alt=\"Wafer cutting inspection case\" title=\"\"><\/figure>\n<\/div>\n<\/div>\n<\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Die Lage, Gr\u00f6\u00dfe und Form der Risse variieren jedes Mal, und traditionelle optische Inspektionen k\u00f6nnen solche unvorhersehbaren Fehler nicht genau identifizieren.<\/p>","protected":false},"author":875,"featured_media":56103,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_gspb_post_css":"#gspb_heading-id-gsbp-98a71402-b1a0{font-size:60px;line-height:100px;text-align:center!important;color:var(--gs-colorone);margin-top:15px;margin-bottom:15px}#gspb_heading-id-gsbp-98a71402-b1a0 .gsap-g-line{text-align:center!important}#gspb_heading-id-gsbp-98a71402-b1a0 .gspb_heading_subtitle,#gspb_subheading-id-gsbp-98a71402-b1a0{display:block;line-height:22px;margin-top:5px;font-size:30px;color:var(--wp--preset--color--white, #ffffff)}.gs-titlebox{background:#fff;line-height:24px;font-size:90%;box-shadow:0 10px 10px #00000007;margin-bottom:25px}.gs-titlebox-text>p{margin-bottom:20px!important;margin-top:0}.gs-titlebox-text>p:last-of-type{margin-bottom:0!important}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox{color:var(--wp--preset--color--black, #000000)}#gspb_titleBox-id-gsbp-0deb1d81-48a5 .gs-titlebox .gs-title-inbox svg,#gspb_titleBox-id-gsbp-d7f236a4-825c .gs-titlebox .gs-title-inbox svg{fill:var(--wp--preset--color--black, #000000)}.gs-titlebox .gs-title-inbox{display:flex;align-content:center;padding:15px 20px;font-weight:700;font-size:115%}.gs-titlebox .gs-title-inbox-label{flex-grow:1}.gs-titlebox .gs-titlebox-text{padding:20px}","footnotes":""},"categories":[3349,3364,3378,3372,3370],"tags":[],"class_list":["post-87643","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-anwenderberichte","category-fehlererkennung","category-semiconductors","category-qualitaetspruefung","category-solvision"],"acf":[],"lang":"de","translations":{"de":87643,"en":32274,"tw":32464,"zh":57064,"jp":78891,"es":82545,"pt":86268,"fr":89163,"vi":93278,"tr":91039,"th":96440,"it":98242,"ko":94733},"_links":{"self":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts\/87643","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/users\/875"}],"replies":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/comments?post=87643"}],"version-history":[{"count":0,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/posts\/87643\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/media\/56103"}],"wp:attachment":[{"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/media?parent=87643"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/categories?post=87643"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/solomon-3d.mesvr.tw\/de\/wp-json\/wp\/v2\/tags?post=87643"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}